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test chip中文是什么意思

  • 测试芯片

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  • 例句与用法
  • Description of a parametrized european mini test chip
    参数化欧洲微型试验芯片的描述
  • Parameter extraction techniques for the european mini test chip
    欧洲微试验芯片用参数提取技术
  • Measurement techniques for the characterization of the european mini test chip
    欧洲微试验芯片特性测量技术
  • Description of the reliability test structures of the european mini test chip
    欧洲微型试验芯片可靠性试验结构的描述
  • Calibration : only 100 % calibration is need while in transmittance mode , and record the original reflectance from the test chip when using the reflectance mode
    标定:在透射时只进行100 %标定,反射时是对比较片的反射比值标定。
  • 4 . through using the concept of logic balance , a high performance telecommunication switch network test chip is accomplished by using xilinx virtex 300e - 6 and the working clock frequency is up to 125mhz . this chip can give an exact test for the network delay time , throughput , network delay time dither , rate of errors and lost data
    4 )结合逻辑平衡的思想,采用xilinxvirtex300e - 6器件,为一家著名的通讯技术有限公司设计了速度达125mhz的交换网测试芯片,能够对交换网的吞吐率,网络延时,网络延时抖动,数据包错误率,包丢失率等进行严格的测试,并根据当前网络的流量大小自动调节网络负载。
  • Abstract : based on the principle of the neuron mos device , a novel matched filter structure which is easily realized by neuron mos is presented and the details of circuit performance is analyzed . compared to the conventional structure , the number of circuit elements is decreased greatly for the same function . the test chip is fabricated in 0 . 35 m process , and the measured result shows that the system structure is feasible and effective
    文摘:在神经元mos基本工作原理的基础上,提出了一种新型的匹配滤波器结构,并对具体电路进行了分析.与传统的匹配滤波器相比,具有结构简单的优点,大大减少了器件数目.最后给出了测试芯片的结果,验证了电路的可行性
  • A convenient and effective testing system for plastic eacapsulated microcircuit is designed . the testing results show that si3n4 passivation on test chip has the better protection than that without si3n4 passivation , and silicone gel coating can prevent moisture from the surface of the chip more effectively than polyimide coating , and molded plastic from varied manufacturers has the different effect on microcircuit due to its diversity
    贮存试验的结果表明,在芯片上加氮化硅钝化层比不加钝化层具有更好的防护效果;与聚酰亚胺胶内涂层相比,硅酮胶内涂层更能有效地阻止水分到达芯片的表面;由于材料本身的差异,不同厂家生产的模塑封装材料对微电路的影响也不同。
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Last modified time:Sun, 10 Aug 2025 00:29:56 GMT

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